DuPont™ Kalrez® 9100 For PECVD/ALD/HDPCVD & Conductor Etch Applications
DuPont™ Kalrez® 9100 is an amber translucent product targeted specifically for PECVD, ALD, HDPCVD and Conductor (Poly/Metal) Etch applications*. Kalrez® 9100 has been specifically designed for low erosion and ultra-low particle generation in harsh plasma environments. It offers excellent thermal stability, very low outgassing as well as excellent elastic recovery and good mechanical strength properties and is well suited for both static and “select” dynamic sealing applications*. A maximum application temperature of 300°C (572°F) is suggested. Ultrapure post-cleaning and packaging is standard for all Kalrez® 9100 parts
Features/Benefits
- Low erosion rate and ultra-low particle generation in oxygen and fluorine-based plasmas
- Excellent resistance to dry process chemistry
- Excellent thermal stability
- Very low outgassing properties and metals content
- Excellent elastic recovery and low compression set properties
Suggested Applications
- Gas inlet/orifice seals
- Chamber lid seals
- Isolation valve seals
- “Select” bonded gate valves/slit valve door seals*
Particle Generation:
Conventional perfluoroelastomer (FFKM) sealing materials normally contain carbon black and/or mineral fillers. Newer products are either unfilled or formulated with polymeric fillers. Plasma resistance can be significantly different depending on the type of filler used. If the filler has high resistance to plasma, such as BaSO4, TiO2, etc., it can “shield” the polymer to reduce erosion or weight loss, but have the high potential for particle generation by leaving discrete particles behind once the polymer has become etched. Unfilled and polymeric filled products essentially contain no other elements other than carbon, fluorine and oxygen, which can be completely etched to form volatiles, thereby significantly reducing the potential for contamination. Figure below shows the relative particle generation of DuPont™ Kalrez® 9100 versus a nano-silica and a metallic oxide filled FFKM product in different plasmas.
Case Study 1 – Custom seal for slit valve opening
PM Cycle Extended 3X! at Major US Fab Line
- Fab line has extended PM cycle from 400 to 1200 Rf hours
- No evidence of degradation or cracking after 1200 Rf hours of service
- Equipment Platform — Lam Research TCP-9600
- Process — Metal Etch and Resist Strip/Ash
- Process Chemistry — Cl2, BCl3, Water Vapor
- Cleaning Chemistry — O2 plasma (cleans ash deposits after every wafer)
Case Study 2 – Lid Assembly
PM Cycle Extended 2X! at Major AP Fab Line
- Fab line has extended PM cycle from 27,000 to 54,000 wafers
- No evidence of erosion, cracking or compression set after processing 54,000 wafers
- Equipment Platform — Applied Material® Producer® SE
- Process — PECVD
- Process Chemistry — TMS, O2, He, Ar • Cleaning Chemistry — NF3
Case Study 3 – Roughing isolation valve poppet seal
PM Target Exceeded at Major European Research Center
- No/minimal evidence of erosion or degradation after processing 5,000 wafers (Figure 2)
- Research center is currently conducting testing to determine maximum practical seal life
- Equipment Platform — Applied Materials™ Centura™ Ultima™
- Process — HDPCVD / STI
- Process Chemistry — SiH4, He, O2,
- Cleaning Chemistry — NF3 plasma at 3000 watts
- Seal Location — Top nozzle assembly O-ring seal
Case Study 4 – Bonded door
PM Cycle Improved 2X! at Major European Fab Line
- Fab line has extended PM cycle from 30,000 to >55,000 pairs of wafers
- No evidence of erosion, mechanical damage, compression set or deformation of the seal lip
- Equipment Platform — Applied Materials™ Producer™ Low-k
- Process — PECVD / Black Diamond™
- Process Chemistry™ — Trimethyl silane (TMS), O2
- Cleaning Chemistry — NF3 plasma via remote plasma source
Case Study 5 – Slit valve door
PM Cycle Extended 3X! at Major US Fab Line
- Fab line has extended PM cycle from 60 to 180 days
- No evidence of erosion, leakage, mechanical damage or compression set after 180 days of service
- Equipment Platform — Novellus™ Concept Two SPEED™
- Process — HDPCVD / STI
- Process Chemistry — SiH4, He, O2
- Cleaning Chemistry — NF3 plasma at 4000 watts
Engineered for plasma-intensive environments, Kalrez® 9100 offers unmatched durability, ultra-low particle generation and up to 3X longer seal life!
Get in touch with our engineering team for expert guidance and application support.